Low pressure Molding, What Is It, How It’s Used and Where, the Process

Low pressure Molding, What Is It, How It's Used and Where, the Process   Low pressure molding is a technique we all see and encounter in our everyday lives, even though you may not realize it, low pressure molding is integral in many of the appliances and equipment you may use daily. It silently goes about its business and you probably don’t give it a second thought. Here at QL-Custom we have many years of experience with low pressure molding, so we thought we’d share some of the main points about this process with you in this article. Here’s a quick take away answer for you, then we’ll dive deeper into the process and benefits of low pressure molding, not only for applications but for the environment too.   So What is Low Pressure Molding? Low Pressure Molding is a technique for protecting and encapsulating components prone to damage, moisture, or other external influences. Typical in applications such as wiring and printed circuit boards. Using materials known as hot-melts, polymers are used to seal around components using specialist machinery.   Dimer acid based Polyamide materials often referred to as ‘hot-melts’, are thermoplastics that, when heated to specific temperatures become pliable and malleable for use around precious connectors and connections.     Why it’s called Low Pressure Molding   Low pressure molding, (or LPM) in particular, is as the name suggests, the use of lower pressure processes and techniques used where components may suffer from the normal pressure or extreme heat otherwise used in more industry standard pressure molding applications. To reiterate, there are two main reasons an application may require the use of Low Pressure Molding.   Malleability One major factor is the need for the applied thermoplastics to be more viscose. Viscosity allows the injected material to be applied...

Low pressure molding

Low pressure molding   Low Pressure Molding History 1972 :France IBM first time. 1987 :Eruope automotive start to molding for electronics 1993 :Use for France automotive wiring harness industry 1995 :Wide use for automotive and extended to electronic 2000 :Use for PCB, Sensoring Device and connectors. After2000: Wide range use for worldwide inudstries.   What is Low Temperature molding The low pressure injection molding process is a packaging process that uses a very low injection pressure to inject the encapsulating aterial into the mold and quickly solidation. In order to achieve insulation, temperature resistance, impact resistance, reduce moisture, waterproof, dust, chemical resistance. Applies to: circuit boards, electronic connectors, wiring harnesses, batteries, switches, LED lights, coils, etc..   Advantages   Short injection cycle Resin Materials environmental protection The compound does not have to be mixed Thermoplastics do not require solidation time High reliability Simple mold design     Advantage of Overmolded parts Waterproof Insulation Impact resistance Temperature resistance Chemical resistance Scrap No harm to the environment     Charactors of the PA PA materials elements   Plastic Resin Elements   Dimer acid based polyamidoamines are the result of Dimer acid based polyamidoamines are the result of polycondensation between diamines and dibasic acids. Where the low pressure plastic resin come from?   Dimer acid extracted from common agricultural products Castor oil Corn oil Linseed oil Peanut oil Vegetable oil Tall oil What is the color of Low Pressure materials     The material is granular Generally black or amberCan be made into other colors   Our provide materials including Inejction Pressure1-200psi(0~60kg) Molding temperature160° C~230° C Protect the property of IC and components Charactor   PA/PO/PET/PUR QL-Custom sufficient stock QL-Custom Professional advice Envirmetal Good insulation properties, flame retardant properties and corrosion resistance How to select the materials of low pressure molding ?  ...