Low pressure molding

Low pressure molding   Low Pressure Molding History 1972 :France IBM first time. 1987 :Eruope automotive start to molding for electronics 1993 :Use for France automotive wiring harness industry 1995 :Wide use for automotive and extended to electronic 2000 :Use for PCB, Sensoring Device and connectors. After2000: Wide range use for worldwide inudstries.   What is Low Temperature molding The low pressure injection molding process is a packaging process that uses a very low injection pressure to inject the encapsulating aterial into the mold and quickly solidation. In order to achieve insulation, temperature resistance, impact resistance, reduce moisture, waterproof, dust, chemical resistance. Applies to: circuit boards, electronic connectors, wiring harnesses, batteries, switches, LED lights, coils, etc..   Advantages   Short injection cycle Resin Materials environmental protection The compound does not have to be mixed Thermoplastics do not require solidation time High reliability Simple mold design     Advantage of Overmolded parts Waterproof Insulation Impact resistance Temperature resistance Chemical resistance Scrap No harm to the environment     Charactors of the PA PA materials elements   Plastic Resin Elements   Dimer acid based polyamidoamines are the result of Dimer acid based polyamidoamines are the result of polycondensation between diamines and dibasic acids. Where the low pressure plastic resin come from?   Dimer acid extracted from common agricultural products Castor oil Corn oil Linseed oil Peanut oil Vegetable oil Tall oil What is the color of Low Pressure materials     The material is granular Generally black or amberCan be made into other colors   Our provide materials including Inejction Pressure1-200psi(0~60kg) Molding temperature160° C~230° C Protect the property of IC and components Charactor   PA/PO/PET/PUR QL-Custom sufficient stock QL-Custom Professional advice Envirmetal Good insulation properties, flame retardant properties and corrosion resistance How to select the materials of low pressure molding ?  ...